EAG Application Solutions for Imaging & Mapping

In its simplest form, imaging is basically looking at a surface’s appearance using microscopy (either optical or electron). The information provided is limited only by the physical capabilities of the instrumentation used. The primary analytical technique employed in this type of analysis is Scanning Electron Microscopy (SEM).

You can also look at the lateral distribution of different materials, elements, or molecules on a surface or cross section using electron beam (SEM, Energy Dispersive X-ray Spectroscopy, and Auger Electron Spectroscopy) or ion beam (Time-of-Flight Secondary Ion Mass Spectrometry and Focused Ion Beam) imaging. These techniques provide maps or images that show the relative positions of different elemental and possibly molecular species, which imparts useful information regarding features, defects, particles, and more.

You can use other imaging techniques to probe different surface properties as well. Raman Spectroscopy typically measures molecular vibrations, providing information on function groups, types of carbon, and stress/strain. Atomic Force Microscopy (AFM) provides surface roughness images and also capacitance, hardness, and magnetic property images. X-ray Photoelectron Spectroscopy (XPS) provides elemental and chemical maps.

On a larger scale, LEXES can be used to map dopants, thin film composition, and impurities across full 200mm and 300mm wafers, as well as wafer pieces. XRR/XRF can be used to map film thickness and density across full wafers. For both techniques 49 point wafer maps are typically generated.

Primary Analytical Techniques

• Auger
• EDS
• FIB
• LEXES
• SEM
• TOF-SIMS
• XRF
• XRR

Secondary Analytical Techniques

• AFM
• Raman
• XPS

Application Notes